• DocumentCode
    1221540
  • Title

    Fuse regrowth kinetics

  • Author

    Lambert, Don ; Gannamani, Ranjit ; Blish, Richard C., II

  • Author_Institution
    Adv. Micro Devices Inc., Sunnyvale, CA, USA
  • Volume
    4
  • Issue
    4
  • fYear
    2004
  • Firstpage
    690
  • Lastpage
    695
  • Abstract
    The kinetics of fuse regrowth during temperature humidity bias (THB) stresses were modeled with a power law for relative humidity (exponent ∼2.3) and a power law for bias voltage (exponent ∼1.7). Using these results we determined the optimal laser cut parameters to maximize product reliability.
  • Keywords
    electric fuses; electrostatic discharge; integrated circuit reliability; kinetic theory; laser materials processing; printed circuit layout; bias voltage; fuse regrowth kinetics; integrated circuit reliability; laser material-processing applications; optimal laser cut parameters; power law; printed circuit layout; product reliability; relative humidity; reliability modeling; temperature humidity bias stresses; Fuses; Humidity; Integrated circuit reliability; Kinetic theory; Laser beam cutting; Laser modes; Power lasers; Stress; Temperature; Voltage;
  • fLanguage
    English
  • Journal_Title
    Device and Materials Reliability, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1530-4388
  • Type

    jour

  • DOI
    10.1109/TDMR.2004.838422
  • Filename
    1388442
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1221540