• DocumentCode
    1222061
  • Title

    Exploration of Power Device Reliability Using Compact Device Models and Fast Electrothermal Simulation

  • Author

    Bryant, Angus T. ; Mawby, Philip A. ; Palmer, Patrick R. ; Santi, Enrico ; Hudgins, Jerry L.

  • Author_Institution
    Sch. of Eng., Univ. of Warwick, Coventry
  • Volume
    44
  • Issue
    3
  • fYear
    2008
  • Firstpage
    894
  • Lastpage
    903
  • Abstract
    This paper presents the application of compact insulated gate bipolar transistor and p-i-n diode models, including features such as local lifetime control and field-stop technology, to the full electrothermal system simulation of a hybrid electric vehicle converter using a lookup table of device losses. The vehicle converter is simulated with an urban driving cycle (the federal urban driving schedule), which is used to generate transient device temperature profiles. A methodology is also described to explore the converter reliability using the temperature profile, with rainflow cycle counting techniques from material fatigue analysis. The effects of ambient temperature, driving style, and converter design on converter reliability are also investigated.
  • Keywords
    fatigue; hybrid electric vehicles; insulated gate bipolar transistors; p-i-n diodes; power bipolar transistors; power convertors; power semiconductor diodes; semiconductor device models; semiconductor device reliability; table lookup; transients; ambient temperature; electrothermal system simulation; hybrid electric vehicle converter; insulated gate bipolar transistor model; lookup table; material fatigue analysis; p-i-n diode model; power device reliability; rainflow cycle counting technique; transient device temperature profile generation; urban driving cycle; Electrothermal effects; Hybrid electric vehicles; Insulated gate bipolar transistors; Materials reliability; P-i-n diodes; Power system modeling; Power system reliability; Table lookup; Temperature; Vehicle driving; Compact modeling; electrothermal simulation; mission profile; power semiconductor devices; rainflow cycle counting; reliability; thermal cycling;
  • fLanguage
    English
  • Journal_Title
    Industry Applications, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0093-9994
  • Type

    jour

  • DOI
    10.1109/TIA.2008.921388
  • Filename
    4523984