Title :
Failure and degradation modes and rates of PV modules in a hot-dry climate: Results after 16 years of field exposure
Author :
Yedidi, K. ; Tatapudi, Sai ; Mallineni, J. ; Knisely, Brett ; Kutiche, J. ; Tamizhmani, G.
Author_Institution :
Photovoltaic Reliability Lab. (ASU-PRL), Arizona State Univ., Mesa, AZ, USA
Abstract :
This study evaluates the frameless modules of same type (model B) in two 16-year old photovoltaic power (PV) systems to ascertain degradation rates, reliability failure modes and safety failure modes which occur in a hot-dry climate. Each system is composed of 1512 modules. The average degradation rate is determined to be 0.85%/year for the best modules and 1.1%/year for all the modules (excluding the safety failed modules). Primary safety failure mode is the backsheet delamination though it is small (less than 1.7%). Primary degradation mode and reliability failure mode may potentially be attributed to encapsulant browning leading to transmittance/current loss and thermo-mechanical solder bond fatigue (cell-ribbon and ribbon-ribbon) leading to series resistance increase. Under the typical 20/20 warranty terms, 0.5-1.7% of the modules qualify for the safety returns, 73-76% of the modules qualify for the warranty claims and 24-26% of the modules are meeting the warranty terms.
Keywords :
electrical safety; failure analysis; photovoltaic power systems; power generation reliability; PV modules; backsheet delamination; cell-ribbon; current loss; degradation rates; encapsulant browning; field exposure; frameless modules; hot-dry climate; photovoltaic power systems; primary safety failure mode; reliability failure modes; ribbon-ribbon; safety returns; series resistance; thermomechanical solder bond fatigue; time 16 year; transmittance loss; warranty claims; warranty terms; Abstracts; Degradation; Meteorology; Propagation losses; Reliability; Safety; Warranties; O&M; degradation; durability; hot dry desert; reliability; safety;
Conference_Titel :
Photovoltaic Specialist Conference (PVSC), 2014 IEEE 40th
Conference_Location :
Denver, CO
DOI :
10.1109/PVSC.2014.6925626