• DocumentCode
    122285
  • Title

    Extracting Cu diffusion parameters in polycrystalline CdTe

  • Author

    Akis, R. ; Brinkman, D. ; Sankin, I. ; Fang, Tao ; Guo, Di ; Vasileska, D. ; Ringhofer, C.

  • Author_Institution
    Sch. of ECEE, Arizona State Univ., Tempe, AZ, USA
  • fYear
    2014
  • fDate
    8-13 June 2014
  • Firstpage
    3276
  • Lastpage
    3281
  • Abstract
    It is well known that Cu plays an important role in CdTe solar cell performance as a dopant. In this work, a finite-difference method is developed and used to simulate Cu diffusion in CdTe solar cells. In the simulations, which are done on a two-dimensional (2D) domain, the CdTe is assumed to be polycrystal-line, with the individual grains separated by grain boundaries. When used to fit experimental Cu concentration data, bulk and grain boundary diffusion coefficients and activation energies for CdTe can be extracted. In the past, diffusion coefficients have been typically obtained by fitting data to simple functional forms of limited validity. By doing full simulations, the simplifying assumptions used in those analytical models are avoided and diffusion parameters can thus be determined more accurately.
  • Keywords
    II-VI semiconductors; cadmium compounds; copper; finite difference methods; grain boundaries; grain boundary diffusion; solar cells; wide band gap semiconductors; CdTe:Cu; activation energies; bulk diffusion; cadmium telluride solar cell performance; concentration profile; diffusion parameters; finite-difference method; grain boundary diffusion coefficients; polycrystalline structure; simple functional forms; two-dimensional domain; Annealing; Finite difference methods; Fitting; Grain boundaries; Mathematical model; Photovoltaic cells; Temperature measurement; CdTe; copper; grain boundaries; impurity diffusion; numerical simulation; photovoltaic cells;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Photovoltaic Specialist Conference (PVSC), 2014 IEEE 40th
  • Conference_Location
    Denver, CO
  • Type

    conf

  • DOI
    10.1109/PVSC.2014.6925635
  • Filename
    6925635