Title :
Impact of die-attach materials on MEMS gyro performance
Author :
Filipe, A. ; Vincent, M. ; Volant, V. ; Kergueris, C.
Author_Institution :
TRONICS Group, Crolles, France
Abstract :
We have performed an experimental assessment of the impact of assembly materials on MEMS gyro thermal behavior. Very significant differences are obtained depending on the type and quantity of die-attach. The analysis gives insights on the proper selection of die-attach materials.
Keywords :
gyroscopes; microassembling; microsensors; temperature sensors; MEMS gyrothermal behavior; die-attach material assembly; Ceramics; Integrated circuits; Micromechanical devices; Packaging; Silicon; Stress; MEMS; die-attach; gyro; materials; packaging;
Conference_Titel :
Inertial Sensors and Systems (ISISS), 2014 International Symposium on
Conference_Location :
Laguna Beach, CA
DOI :
10.1109/ISISS.2014.6782530
