DocumentCode :
1227690
Title :
Experiments of device failures in a spatial power-combining array
Author :
Lin, Jenshan ; Itoh, Tatsuo
Author_Institution :
Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
Volume :
43
Issue :
2
fYear :
1995
fDate :
2/1/1995 12:00:00 AM
Firstpage :
267
Lastpage :
271
Abstract :
The performance of a spatial power-combining array with device failure is investigated. Experimental results show that the array still combines the power in the broadside direction when the DC open-circuit failure occurs. Analysis of measured radiation patterns indicated that the power radiated from the patch antenna attached to the failed device is much smaller than the power radiated from other patch antennas. The effects of the chip resistor and the RF impedance of failed device are discussed
Keywords :
MMIC; active antenna arrays; antenna radiation patterns; microstrip antenna arrays; microstrip circuits; power combiners; DC open-circuit failure; RF impedance; active antenna; broadside direction; chip resistor; device failures; microstrip circuit; patch antenna; quasi-optical oscillators; radiation patterns; spatial power-combining array; Antenna measurements; Antenna radiation patterns; Failure analysis; Impedance; Patch antennas; Pattern analysis; Power measurement; Radio frequency; Resistors; Semiconductor device measurement;
fLanguage :
English
Journal_Title :
Microwave Theory and Techniques, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9480
Type :
jour
DOI :
10.1109/22.348083
Filename :
348083
Link To Document :
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