DocumentCode :
1228269
Title :
Wafer level system integration: a review
Author :
Tewksbury, S.K. ; Hornak, L.A.
Volume :
5
Issue :
5
fYear :
1989
Firstpage :
22
Lastpage :
30
Abstract :
Highlights the major trends and issues affecting monolithic wafer-scale circuits and hybrid wafer-scale circuits, i.e. pretested chips mounted on silicon wafer circuit boards. An extensive set of references is provided to avoid repeating detailed discussions available in the cited literature. Instead, a broad overview of the objectives and motivations of the considerable work on wafer-level system components is provided. It is emphasized that wafer-scale integration provides a foundation on which future systems, perhaps including advanced semiconductor technologies for high-performance components, can achieve evolutionary increases in performance and decreases in system size.<>
Keywords :
hybrid integrated circuits; integrated circuit technology; monolithic integrated circuits; reviews; Si wafer circuit boards; advanced semiconductor technologies; hybrid wafer-scale circuits; monolithic wafer-scale circuits; performance; system size; wafer-level system components; Printed circuits; Silicon; Wafer scale integration;
fLanguage :
English
Journal_Title :
Circuits and Devices Magazine, IEEE
Publisher :
ieee
ISSN :
8755-3996
Type :
jour
DOI :
10.1109/101.34897
Filename :
34897
Link To Document :
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