DocumentCode :
1228346
Title :
Four-Terminal FinFETs Fabricated Using an Etch-Back Gate Separation
Author :
Endo, Kazuhiko ; Ishikawa, Yuki ; Liu, Yongxun ; Ishii, Kenichi ; Matsukawa, Takashi ; O´Uchi, Shin-Ichi ; Masahara, Meishoku ; Sugimata, Etsuro ; Tsukada, Jyunichi ; Yamauchi, Hiromi ; Suzuki, Eiichi
Author_Institution :
Nat. Inst. of Adv. Ind. Sci. & Technol., Ibaraki
Volume :
6
Issue :
2
fYear :
2007
fDate :
3/1/2007 12:00:00 AM
Firstpage :
201
Lastpage :
205
Abstract :
A novel resist etch-back process for fabrication of separated-gate four-terminal FinFETs has been investigates. This process enabled co-fabrication of three-terminal (3T) and four-terminal (4T) FinFETs on a same chip. The fabricated 3T-FinFET shows excellent sub-threshold characteristics and drain induced barrier lowering (DIBL) value whereas the 4T-FinFET provides efficient Vth controllability. The effective Vth controllability with keeping a small sub-threshold slope has been confirmed in the synchronized double gate (DD) operation mode
Keywords :
MOSFET; etching; resists; DIBL value; drain induced barrier lowering value; four-terminal FinFETs fabrication; resist etch-back gate separation; three-terminal FinFETs fabrication; CMOS technology; Controllability; Energy consumption; Etching; Fabrication; FinFETs; MOSFET circuits; Resists; Threshold voltage; Ultra large scale integration; ${rm V}_{rm th}$ control; Etch-back; FinFET; four-terminal; gate-separation;
fLanguage :
English
Journal_Title :
Nanotechnology, IEEE Transactions on
Publisher :
ieee
ISSN :
1536-125X
Type :
jour
DOI :
10.1109/TNANO.2007.891830
Filename :
4126507
Link To Document :
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