DocumentCode :
1228926
Title :
ESD Protection Design With On-Chip ESD Bus and High-Voltage-Tolerant ESD Clamp Circuit for Mixed-Voltage I/O Buffers
Author :
Ker, Ming-Dou ; Chang, Wei-Jen
Author_Institution :
Nanoelectron. & Gigascale Syst. Lab., Nat. Chiao-Tung Univ., Hsinchu
Volume :
55
Issue :
6
fYear :
2008
fDate :
6/1/2008 12:00:00 AM
Firstpage :
1409
Lastpage :
1416
Abstract :
Considering gate-oxide reliability, a new electrostatic discharge (ESD) protection scheme with an on-chip ESD bus (ESD_BUS) and a high-voltage-tolerant ESD clamp circuit for 1.2/2.5 V mixed-voltage I/O interfaces is proposed. The devices used in the high-voltage-tolerant ESD clamp circuit are all 1.2 V low-voltage N- and P-type MOS devices that can be safely operated under the 2.5-V bias conditions without suffering from the gate-oxide reliability issue. The four-mode (positive-to-VSS, negative-to-VSS, positive-to-VDD, and negative-to-VDD) ESD stresses on the mixed-voltage I/O pad and pin-to-pin ESD stresses can be effectively discharged by the proposed ESD protection scheme. The experimental results verified in a 0.13-mum CMOS process have confirmed that the proposed new ESD protection scheme has high human-body model (HBM) and machine-model (MM) ESD robustness with a fast turn-on speed. The proposed new ESD protection scheme, which is designed with only low- voltage devices, is an excellent and cost-efficient solution to protect mixed-voltage I/O interfaces.
Keywords :
CMOS integrated circuits; electrostatic discharge; integrated circuit design; CMOS process; ESD protection design; MOS devices; electrostatic discharge protection; gate-oxide reliability; high-voltage-tolerant ESD clamp circuit; human-body model; machine-model; mixed-voltage I-O buffers; on-chip ESD bus; voltage 1.2 V; voltage 2.5 V; CMOS process; Circuits; Clamps; Electrostatic discharge; MOS devices; Protection; Robustness; Semiconductor device modeling; Stress; Voltage; Electrostatic discharge (ESD); I/O; high-voltagetolerant ESD clamp circuit; mixed-voltage secondary; on-chip ESD bus; secondary breakdown current (${rm I}_{t2}$) substrate-triggered technique;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/TED.2008.920972
Filename :
4527058
Link To Document :
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