• DocumentCode
    1228926
  • Title

    ESD Protection Design With On-Chip ESD Bus and High-Voltage-Tolerant ESD Clamp Circuit for Mixed-Voltage I/O Buffers

  • Author

    Ker, Ming-Dou ; Chang, Wei-Jen

  • Author_Institution
    Nanoelectron. & Gigascale Syst. Lab., Nat. Chiao-Tung Univ., Hsinchu
  • Volume
    55
  • Issue
    6
  • fYear
    2008
  • fDate
    6/1/2008 12:00:00 AM
  • Firstpage
    1409
  • Lastpage
    1416
  • Abstract
    Considering gate-oxide reliability, a new electrostatic discharge (ESD) protection scheme with an on-chip ESD bus (ESD_BUS) and a high-voltage-tolerant ESD clamp circuit for 1.2/2.5 V mixed-voltage I/O interfaces is proposed. The devices used in the high-voltage-tolerant ESD clamp circuit are all 1.2 V low-voltage N- and P-type MOS devices that can be safely operated under the 2.5-V bias conditions without suffering from the gate-oxide reliability issue. The four-mode (positive-to-VSS, negative-to-VSS, positive-to-VDD, and negative-to-VDD) ESD stresses on the mixed-voltage I/O pad and pin-to-pin ESD stresses can be effectively discharged by the proposed ESD protection scheme. The experimental results verified in a 0.13-mum CMOS process have confirmed that the proposed new ESD protection scheme has high human-body model (HBM) and machine-model (MM) ESD robustness with a fast turn-on speed. The proposed new ESD protection scheme, which is designed with only low- voltage devices, is an excellent and cost-efficient solution to protect mixed-voltage I/O interfaces.
  • Keywords
    CMOS integrated circuits; electrostatic discharge; integrated circuit design; CMOS process; ESD protection design; MOS devices; electrostatic discharge protection; gate-oxide reliability; high-voltage-tolerant ESD clamp circuit; human-body model; machine-model; mixed-voltage I-O buffers; on-chip ESD bus; voltage 1.2 V; voltage 2.5 V; CMOS process; Circuits; Clamps; Electrostatic discharge; MOS devices; Protection; Robustness; Semiconductor device modeling; Stress; Voltage; Electrostatic discharge (ESD); I/O; high-voltagetolerant ESD clamp circuit; mixed-voltage secondary; on-chip ESD bus; secondary breakdown current (${rm I}_{t2}$) substrate-triggered technique;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2008.920972
  • Filename
    4527058