• DocumentCode
    1228969
  • Title

    Investigation on Self-Heating Effect in Gate-All-Around Silicon Nanowire MOSFETs From Top-Down Approach

  • Author

    Wang, Runsheng ; Zhuge, Jing ; Huang, Ru ; Kim, Dong-Won ; Park, Donggun ; Wang, Yangyuan

  • Author_Institution
    Inst. of Microelectron., Peking Univ., Beijing
  • Volume
    30
  • Issue
    5
  • fYear
    2009
  • fDate
    5/1/2009 12:00:00 AM
  • Firstpage
    559
  • Lastpage
    561
  • Abstract
    The self-heating effect is becoming a critical concern for nanoscaled devices with low dimensions. In this letter, the self-heating effect is experimentally investigated in gate-all-around (GAA) silicon nanowire MOSFETs (SNWTs) fabricated from the CMOS-compatible top-down approach. With the multifinger and multiwire test structure, the impact of the self-heating effect is successfully characterized. The results indicate that even if the SNWT is fabricated on the bulk silicon substrate, the impact of the self-heating effect is comparable or even a little bit worse than that in SOI devices, probably due to the 1-D nature of nanowire and increased phonon-boundary scattering in the GAA architecture.
  • Keywords
    CMOS integrated circuits; MOSFET; nanowires; silicon-on-insulator; CMOS-compatible top-down approach; SOI devices; Si; bulk silicon substrate; gate-all-around silicon nanowire MOSFET; multifinger test structure; multiwire test structure; phonon-boundary scattering; self-heating effect; Gate-all-around (GAA); self-heating effect; silicon nanowire MOSFET (SNWT);
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/LED.2009.2016764
  • Filename
    4812047