DocumentCode :
1228983
Title :
High electromagnetic shielding of plastic package for 2.5-Gb/s optical transceiver modules
Author :
Wu, Tzong-Lin ; Lin, Cheng-Wei ; Hung, Wen-Chi ; Lee, Chien-Hui ; Jou, Wern-Shiarng ; Cheng, Wood-Hi
Author_Institution :
Dept. of Electr. Eng., Nat. Sun Yat-sen Univ., Kaohsiung
Volume :
28
Issue :
1
fYear :
2005
Firstpage :
89
Lastpage :
95
Abstract :
A lightweight, low-cost plastic package for a 2.5-Gb/s optical transceiver module, that also has good electromagnetic shielding properties, has been fabricated using woven continuous carbon fiber (CCF) epoxy composite. The shielding effectiveness (SE) of the CCF epoxy composite has been modeled theoretically and measured from 500 MHz to 3 GHz using the ASTM D4935 and a near-field test method. Two types of weaving patterns were studied: a balanced twill structure (BTS) and a parallel structure. The BTS was able to achieve an SE of about 80 dB under plane wave conditions and about 50 dB under near-field conditions because of the numerous conductive between crossing fibers. The SE of the proposed package is at least 20 dB greater than the previous package which used a liquid crystal polymer composite. In addition to better shielding performance, the proposed package costs less because it uses less carbon fiber. The proposed package for an optical transceiver is suitable for use in a low-cost lightwave transmission system
Keywords :
carbon fibres; composite materials; electromagnetic interference; electromagnetic shielding; optical receivers; plastic packaging; plastics; transceivers; 2.5 Gbit/s; 5E08 to 3E09 Hz; ASTM D4935; CCF epoxy composite; balanced twill structure; electromagnetic interference; electromagnetic shielding; low-cost lightwave transmission system; near-field condition; near-field test method; optical packages; optical transceiver modules; parallel structure; plane wave condition; plastic composites; plastic package; shielding effectiveness; weaving pattern; woven continuous carbon fiber; Carbon compounds; Carbon dioxide; Costs; Electromagnetic interference; Electromagnetic shielding; High speed optical techniques; Optical fiber testing; Optical polymers; Plastic packaging; Transceivers; Electromagnetic interference (EMI); optical packages; optical transceiver modules; plastic composites; plastic packages; shielding effectiveness (SE);
fLanguage :
English
Journal_Title :
Advanced Packaging, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3323
Type :
jour
DOI :
10.1109/TADVP.2004.841667
Filename :
1391071
Link To Document :
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