DocumentCode
1229025
Title
Wavelength-tunable laser module using low-temperature cofired ceramic substrates
Author
Heikkinen, Veli ; Aikio, Janne ; Alajoki, Teemu ; Kautio, Kari ; Ollila, Jyrki ; Karioja, Pentti
Author_Institution
VTT Electron., Oulu
Volume
28
Issue
1
fYear
2005
Firstpage
121
Lastpage
127
Abstract
We realized a prototype series of the 1550-nm band wavelength-tunable laser module. The edge-emitting Fabry-Perot diode laser operates in the short external cavity configuration and is tuned by a silicon surface micromachined Fabry-Peacuterot interferometer device. Low-temperature cofired ceramic (LTCC) substrate technology was used in the module packaging to enable the passive alignment of the photonic components. Low conductor resistance and dielectric loss, multilayer structures with fine-line capability, compatibility with hermetic sealing, and the ability to integrate passive electrical components (resistors, capacitors, and inductors) into the substrate make LTCC a useful technology for telecommunication applications. In addition, the fair match of the thermal expansion coefficient to optoelectronic chips reduces packaging-induced thermomechanical stresses. The precision three-dimensional (3-D) structures, such as cavities, holes, and channels manufactured in the ceramic parts, ease the packaging process via the passive assembly. The wavelength tuning range of the realized modules ranged from 8 to 19 nm and single-mode fiber-coupled output power was between 100 and 570 muW. The hybrid arrangement uses standard laser chips and, therefore, potentially provides a cost-effective and easily configurable solution for last-mile fiber optic communications
Keywords
Fabry-Perot interferometers; ceramic packaging; integrated optoelectronics; laser tuning; microassembling; semiconductor lasers; 100 to 570 muW; 1550 nm; 8 to 19 nm; Fabry-Perot diode laser; Fabry-Perot interferometer device; conductor resistance; dielectric loss; fiber optic communications; fine-line capability; hermetic sealing; hybrid integrated circuit packaging; integrated passive electrical components; laser chips; low-temperature cofired ceramic substrates; microassembly technique; module packaging; multilayer structures; optoelectronic chips; packaging-induced thermomechanical stresses; passive alignment; passive assembly; photonic components; precision 3D structures; semiconductor lasers; short external cavity configuration; silicon surface; single-mode fiber; telecommunication applications; thermal expansion coefficient; tunable lasers; wavelength-tunable laser module; Ceramics; Dielectric losses; Dielectric substrates; Diode lasers; Fabry-Perot; Laser tuning; Optical fiber communication; Packaging; Prototypes; Thermal stresses; Ceramics; Fabry–PÉrot interferometers; hybrid integrated circuit packaging; low-temperature cofired ceramic (LTCC) substrates; microassembly; optoelectronic devices; packaging; semiconductor lasers; tunable lasers;
fLanguage
English
Journal_Title
Advanced Packaging, IEEE Transactions on
Publisher
ieee
ISSN
1521-3323
Type
jour
DOI
10.1109/TADVP.2004.841664
Filename
1391075
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