• DocumentCode
    1229025
  • Title

    Wavelength-tunable laser module using low-temperature cofired ceramic substrates

  • Author

    Heikkinen, Veli ; Aikio, Janne ; Alajoki, Teemu ; Kautio, Kari ; Ollila, Jyrki ; Karioja, Pentti

  • Author_Institution
    VTT Electron., Oulu
  • Volume
    28
  • Issue
    1
  • fYear
    2005
  • Firstpage
    121
  • Lastpage
    127
  • Abstract
    We realized a prototype series of the 1550-nm band wavelength-tunable laser module. The edge-emitting Fabry-Perot diode laser operates in the short external cavity configuration and is tuned by a silicon surface micromachined Fabry-Peacuterot interferometer device. Low-temperature cofired ceramic (LTCC) substrate technology was used in the module packaging to enable the passive alignment of the photonic components. Low conductor resistance and dielectric loss, multilayer structures with fine-line capability, compatibility with hermetic sealing, and the ability to integrate passive electrical components (resistors, capacitors, and inductors) into the substrate make LTCC a useful technology for telecommunication applications. In addition, the fair match of the thermal expansion coefficient to optoelectronic chips reduces packaging-induced thermomechanical stresses. The precision three-dimensional (3-D) structures, such as cavities, holes, and channels manufactured in the ceramic parts, ease the packaging process via the passive assembly. The wavelength tuning range of the realized modules ranged from 8 to 19 nm and single-mode fiber-coupled output power was between 100 and 570 muW. The hybrid arrangement uses standard laser chips and, therefore, potentially provides a cost-effective and easily configurable solution for last-mile fiber optic communications
  • Keywords
    Fabry-Perot interferometers; ceramic packaging; integrated optoelectronics; laser tuning; microassembling; semiconductor lasers; 100 to 570 muW; 1550 nm; 8 to 19 nm; Fabry-Perot diode laser; Fabry-Perot interferometer device; conductor resistance; dielectric loss; fiber optic communications; fine-line capability; hermetic sealing; hybrid integrated circuit packaging; integrated passive electrical components; laser chips; low-temperature cofired ceramic substrates; microassembly technique; module packaging; multilayer structures; optoelectronic chips; packaging-induced thermomechanical stresses; passive alignment; passive assembly; photonic components; precision 3D structures; semiconductor lasers; short external cavity configuration; silicon surface; single-mode fiber; telecommunication applications; thermal expansion coefficient; tunable lasers; wavelength-tunable laser module; Ceramics; Dielectric losses; Dielectric substrates; Diode lasers; Fabry-Perot; Laser tuning; Optical fiber communication; Packaging; Prototypes; Thermal stresses; Ceramics; Fabry–PÉrot interferometers; hybrid integrated circuit packaging; low-temperature cofired ceramic (LTCC) substrates; microassembly; optoelectronic devices; packaging; semiconductor lasers; tunable lasers;
  • fLanguage
    English
  • Journal_Title
    Advanced Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3323
  • Type

    jour

  • DOI
    10.1109/TADVP.2004.841664
  • Filename
    1391075