Title :
Table of contents
Abstract :
The following topics are dealt with: memory circuits; system-level analysis; multicore systems; SoC verification; electronic package; 3D integration; nanoscale CMOS; low power design methodologies; reliability; aging; circuit design; power grid analysis; and smart sensors design technology.
Keywords :
CMOS integrated circuits; ageing; electronics packaging; integrated circuit design; intelligent sensors; low-power electronics; microprocessor chips; multiprocessing systems; reliability; system-on-chip; 3D integration; SoC verification; aging; circuit design; electronic package; low power design methodologies; memory circuits; multicore systems; nanoscale CMOS; power grid analysis; reliability; smart sensors design technology; system-level analysis;
Conference_Titel :
Quality Electronic Design (ISQED), 2014 15th International Symposium on
Conference_Location :
Santa Clara, CA
Print_ISBN :
978-1-4799-3945-9
DOI :
10.1109/ISQED.2014.6783298
