DocumentCode
1230235
Title
Integrated Circuit Hybrid, and Multichip Module Package Design Guidelines [Books and Reports]
Author
Pecht, Michael
Volume
15
Issue
1
fYear
1995
fDate
1/1/1995 12:00:00 AM
Firstpage
33
Keywords
Electronic switching systems; Guidelines; Hybrid integrated circuits; Integrated circuit packaging; Lead; Material storage; Multichip modules; Power engineering and energy; Pulp manufacturing; Thermal management;
fLanguage
English
Journal_Title
Power Engineering Review, IEEE
Publisher
ieee
ISSN
0272-1724
Type
jour
DOI
10.1109/MPER.1995.350451
Filename
350451
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