DocumentCode
1230801
Title
Integrated Circuit Inspection Via Acoustic Microscopy
Author
Weglein, Rolf D.
Volume
30
Issue
1
fYear
1983
Firstpage
40
Lastpage
42
Keywords
Acoustic devices; Acoustic imaging; Acoustic reflection; Acoustic waves; Flip chip; Inspection; Optical films; Optical microscopy; Optical reflection; Sensor arrays;
fLanguage
English
Journal_Title
Sonics and Ultrasonics, IEEE Transactions on
Publisher
ieee
ISSN
0018-9537
Type
jour
DOI
10.1109/T-SU.1983.31381
Filename
1539457
Link To Document