DocumentCode
1230933
Title
Temperature Compensation of Transducers Using Semiconductor Strain Gages
Author
Shearer, C.Ray
Author_Institution
Micro Systems Incorporated Pasadena, California
Issue
2
fYear
1965
fDate
6/1/1965 12:00:00 AM
Firstpage
53
Lastpage
59
Abstract
Temperature compensation of transducers using semiconductor strain gages involves an understanding of the interrelationships between basic sensor performance, transducer design and compensation techniques. This paper describes some of these interrelationships and gives specific information regarding conventional temperature compensation approaches used on production hardware.
Keywords
Aerospace testing; Bridge circuits; Capacitive sensors; Electric resistance; Semiconductor device doping; Sensor phenomena and characterization; Sensor systems; Silicon; Temperature sensors; Transducers;
fLanguage
English
Journal_Title
Aerospace, IEEE Transactions on
Publisher
ieee
ISSN
0536-1516
Type
jour
DOI
10.1109/TA.1965.4319781
Filename
4319781
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