XFACT: a furnace analysis and characterization tool

Author

de Gyvez, Jose Pineda

Volume

8

Issue

1

fYear

1995

fDate

2/1/1995 12:00:00 AM

Firstpage

84

Lastpage

87

Abstract

The diffusion furnace is one the most important and complex process equipment in the process line and efforts towards characterizing it will be well worth the effort. A CAM package for wafer temperature map reconstruction using only a few sampled data points is proposed. The software is completely generic and has no affiliation to any make of furnace. The data required for simulation can easily be obtained from the actual piece of equipment. Interpolation techniques with high accuracy are used for developing the temperature contours inside the furnace using a modified version of the Lagrange´s interpolation technique

Keywords

computer aided analysis; furnaces; integrated circuit manufacture; interpolation; production engineering computing; semiconductor process modelling; simulation; temperature distribution; thermal analysis; thermal diffusion; CAM package; IC production; VLSI manufacture; XFACT; diffusion furnace; furnace analysis tool; furnace characterization tool; interpolation techniques; process equipment; temperature contours; wafer temperature map reconstruction; CADCAM; Computer aided manufacturing; Furnaces; Interpolation; Lagrangian functions; Manufacturing processes; Packaging machines; Temperature distribution; Temperature measurement; Very large scale integration;

fLanguage

English

Journal_Title

Semiconductor Manufacturing, IEEE Transactions on

Publisher

ieee

ISSN

0894-6507

Type

jour

DOI

10.1109/66.350761

Filename

350761