• DocumentCode
    1231466
  • Title

    Interconnect opportunities for gigascale integration

  • Author

    Meindl, James D.

  • Author_Institution
    Georgia Inst. of Technol., Atlanta, GA, USA
  • Volume
    23
  • Issue
    3
  • fYear
    2003
  • Firstpage
    28
  • Lastpage
    35
  • Abstract
    During the past decade, interconnects have replaced transistors as the dominant determiner of chip performance. To sustain the historical rate of advance in performance, monolithic interconnect technology has rapidly evolved to keep pace with advances in transistor density and performance. New and radically different interconnect technologies will become increasingly important to future gigascale microsystems.
  • Keywords
    integrated circuit interconnections; integrated optics; network routing; system-on-chip; technological forecasting; 3D integration; gigascale integration; microphotonics; monolithic interconnect technology; multilevel interconnect network; polylithic integration; reverse scaling; system on chip; transistor density; Aluminum; Clocks; Delay; Energy dissipation; Integrated circuit interconnections; MOSFET circuits; Power system interconnection; Transistors; Ultra large scale integration; Voltage;
  • fLanguage
    English
  • Journal_Title
    Micro, IEEE
  • Publisher
    ieee
  • ISSN
    0272-1732
  • Type

    jour

  • DOI
    10.1109/MM.2003.1209464
  • Filename
    1209464