DocumentCode
1231466
Title
Interconnect opportunities for gigascale integration
Author
Meindl, James D.
Author_Institution
Georgia Inst. of Technol., Atlanta, GA, USA
Volume
23
Issue
3
fYear
2003
Firstpage
28
Lastpage
35
Abstract
During the past decade, interconnects have replaced transistors as the dominant determiner of chip performance. To sustain the historical rate of advance in performance, monolithic interconnect technology has rapidly evolved to keep pace with advances in transistor density and performance. New and radically different interconnect technologies will become increasingly important to future gigascale microsystems.
Keywords
integrated circuit interconnections; integrated optics; network routing; system-on-chip; technological forecasting; 3D integration; gigascale integration; microphotonics; monolithic interconnect technology; multilevel interconnect network; polylithic integration; reverse scaling; system on chip; transistor density; Aluminum; Clocks; Delay; Energy dissipation; Integrated circuit interconnections; MOSFET circuits; Power system interconnection; Transistors; Ultra large scale integration; Voltage;
fLanguage
English
Journal_Title
Micro, IEEE
Publisher
ieee
ISSN
0272-1732
Type
jour
DOI
10.1109/MM.2003.1209464
Filename
1209464
Link To Document