Title :
ICPA for highly integrated concurrent dual-band wireless receivers
Author :
Zhang, C.C. ; Liu, J.J. ; Zhang, Y.F.
Author_Institution :
Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore
fDate :
6/12/2003 12:00:00 AM
Abstract :
A single-feed dual-band integrated circuit package antenna (ICPA) is reported. The ICPA, intended for use in either single-chip or single-package highly integrated concurrent dual-band wireless receivers, is implemented in the format of a cavity-down ceramic ball grid array package of 15×15×1.9 mm3. Results show that the ICPA achieved a frequency ratio of 2.2, return loss bandwidth of 1.67% and gain of -8 dBi at 2.4 GHz, and return loss bandwidth of 0.69% and gain of -2 dBi at 5.25 GHz.
Keywords :
UHF antennas; ball grid arrays; ceramic packaging; microwave antennas; multibeam antennas; receiving antennas; 2.4 GHz; 5.25 GHz; ICPA; cavity-down ceramic ball grid array package; concurrent dual-band wireless receivers; frequency ratio; gain; integrated circuit package antenna; return loss bandwidth; single-feed dual-band antenna; wireless receivers;
Journal_Title :
Electronics Letters
DOI :
10.1049/el:20030582
