• DocumentCode
    123159
  • Title

    Assessing uniqueness and reliability of SRAM-based Physical Unclonable Functions from silicon measurements in 45-nm bulk CMOS

  • Author

    Fujiwara, H. ; Yabuuchi, M. ; Nii, Koji

  • Author_Institution
    Renesas Electron. Corp., Kodaira, Japan
  • fYear
    2014
  • fDate
    3-5 March 2014
  • Firstpage
    523
  • Lastpage
    528
  • Abstract
    Assessments of the uniqueness and reliability for SRAM-based Physical Unclonable Functions (PUFs) embedded in dies were conducted using silicon measurements. To generate an intrinsic identification (ID) for each die, embedded SRAM PUFs of three types were implemented using 45-nm bulk CMOS technology: 1) single power-on scheme, 2) divided-power-on scheme, and 3) low/low writing scheme. Measured Hamming distances of IDs between 64 dies showed no significant advantage or disadvantage in three SRAM-based PUFs in terms of uniqueness, being acceptable for practical use. The measured error rates of IDs in iteration, supply voltage variation, and temperature variation show that the divided-power-on scheme has better reliability than the other schemes.
  • Keywords
    CMOS memory circuits; SRAM chips; elemental semiconductors; integrated circuit reliability; silicon; Hamming distances; SRAM-based physical unclonable function reliability; bulk CMOS technology; dies; divided-power-on scheme; embedded SRAM PUF; error rates; intrinsic identification; iteration; low-low-writing scheme; silicon measurements; single-power-on scheme; size 45 nm; supply voltage variation; temperature variation; Hamming distance; High definition video; Random access memory; Semiconductor device measurement; Temperature measurement; Voltage measurement; Writing; PUF; Physical unclonable function; Reliability; SRAM; Uniqueness;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Quality Electronic Design (ISQED), 2014 15th International Symposium on
  • Conference_Location
    Santa Clara, CA
  • Print_ISBN
    978-1-4799-3945-9
  • Type

    conf

  • DOI
    10.1109/ISQED.2014.6783371
  • Filename
    6783371