Title : 
Building energy-efficient multi-level cell STT-MRAM based cache through dynamic data-resistance encoding
         
        
            Author : 
Ping Chi ; Cong Xu ; Xiaochun Zhu ; Yuan Xie
         
        
            Author_Institution : 
Comput. Sci. & Eng. Dept., Pennsylvania State Univ., University Park, PA, USA
         
        
        
        
        
        
            Abstract : 
With attractive advantages like high density and low leakage, Spin-Transfer Torque Magnetoresistive RAM (STT-MRAM) is a promising candidate to replace conventional SRAM technology to build large-size and low-power on-chip caches. Multi-level cell (MLC) STT-MRAM, with a higher density, further improves the on-chip cache capacity for chip multiprocessor (CMP) systems. However, the notorious high write energy impedes the adoption of MLC STT-MRAM. In this paper, we focus on minimizing the energy consumption during MLC STT-MRAM write operations. Based on the strong dependency of write energy on data values, a dynamic encoding technique is proposed to map the most frequently appearing data patterns to the most energy-efficient resistance states at runtime. Our experimental results show that, compared with the existing static data mapping scheme, our technique reduces write energy by 12.4% on average and up to 25.4% for a typical MLC STT-MRAM cache.
         
        
            Keywords : 
MRAM devices; cache storage; microprocessor chips; CMP systems; MLC spin-transfer torque magnetoresistive RAM; cache through dynamic data-resistance encoding; chip multiprocessor systems; data patterns; data values; energy-efficient resistance; low-power on-chip caches; multilevel cell STT-MRAM; on-chip cache capacity; static data mapping scheme; write energy; write operations; Decoding; Encoding; Energy consumption; Magnetic tunneling; Random access memory; Resistance; Switches;
         
        
        
        
            Conference_Titel : 
Quality Electronic Design (ISQED), 2014 15th International Symposium on
         
        
            Conference_Location : 
Santa Clara, CA
         
        
            Print_ISBN : 
978-1-4799-3945-9
         
        
        
            DOI : 
10.1109/ISQED.2014.6783387