Thermal crosstalk in a group of pyroelectric sensitive elements for thermal imaging

Author

Yoon, Yung Sup ; Samoilov, Vladimir B. ; Kletsky, Sergci V.

Author_Institution

Res. Inst. of Semicond. & Thin Film Technol., Inha Univ., Inchon, South Korea

Volume

50

Issue

6

fYear

2003

fDate

6/1/2003 12:00:00 AM

Firstpage

720

Lastpage

723

Abstract

Temperature distributions under periodical thermal excitation and the response of the thermal imaging device, composed of the group of pyroelectric sensitive elements mounted on a single silicon substrate, are presented. The sensitive element consists of a covering metal layer, infrared polymer absorber, front metal contact, sensitive pyroelectric element, the interconnecting column, and the bulk silicon readout. The results of numerical modeling show that the thermal crosstalk between sensitive elements to be critical especially at low frequency (f<10 Hz) of periodically modulated light.

Keywords

crosstalk; image sensors; infrared imaging; modelling; pyroelectric detectors; silicon; temperature distribution; 10 Hz; 2D modeling; Si; bulk Si readout; dynamic voltage response; front metal contact; infrared polymer absorber; interconnecting column; numerical modeling; periodical thermal excitation; periodically modulated light; pyroelectric sensitive elements; single Si substrate; temperature distributions; thermal crosstalk; thermal imaging device; Crosstalk; Frequency; Infrared detectors; Numerical models; Optical modulation; Physics; Polymers; Pyroelectricity; Sensor arrays; Silicon;

fLanguage

English

Journal_Title

Ultrasonics, Ferroelectrics, and Frequency Control, IEEE Transactions on

Publisher

ieee

ISSN

0885-3010

Type

jour

DOI

10.1109/TUFFC.2003.1209561

Filename

1209561