DocumentCode :
1233026
Title :
Factory throughput improvements through intelligent integrated delivery in semiconductor fabrication facilities
Author :
Li, Bo ; Wu, Johnny ; Carriker, Wayne ; Giddings, Ross
Author_Institution :
Autom. Dept. of Portland Technol. Dev., Intel Corp., Hillsboro, OR, USA
Volume :
18
Issue :
1
fYear :
2005
Firstpage :
222
Lastpage :
231
Abstract :
"Integrated Delivery" is a system that integrates the automated material handling systems (AMHS) with process tools to automate the flow of material through a semiconductor fabrication facility (fab). It was developed to streamline operations in fully mechanized 300-mm wafer fabs by automating the delivery of lots to/from the tools, and automating all aspects of lot processing, with no manual intervention. Within this context, lot delivery performance is a critical factor impacting factory throughput. Poor material delivery performance translates into tools sitting idle waiting for lots to be delivered, which increases tool cycle time and decreases output. This work describes intelligent integrated delivery (IID) capabilities, including just-in-time proactive material movement and delivery prioritization, to reduce delivery time impacts. These capabilities significantly reduce the lot delivery queue time, and as a result, measurably improve factory throughput. The results have been demonstrated via theoretical modeling, as well through actual deployment in Intel\´s 300 mm fabs.
Keywords :
electronics industry; integrated circuit manufacture; machine tools; materials handling equipment; production facilities; semiconductor device manufacture; 300 nm; automated material handling systems; intelligent integrated delivery; lot delivery queue time; semiconductor fabrication facility; tool cycle time; Fabrication; Joining processes; Manuals; Manufacturing automation; Materials handling; Performance analysis; Production facilities; Semiconductor device modeling; Throughput; Time measurement;
fLanguage :
English
Journal_Title :
Semiconductor Manufacturing, IEEE Transactions on
Publisher :
ieee
ISSN :
0894-6507
Type :
jour
DOI :
10.1109/TSM.2004.840530
Filename :
1393063
Link To Document :
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