DocumentCode :
1233299
Title :
IEEE Components, Packaging, and Manufacturing Technology Society Information for authors
Volume :
27
Issue :
4
fYear :
2004
Abstract :
Provides instructions and guidelines to prospective authors who wish to submit manuscripts.
fLanguage :
English
Journal_Title :
Electronics Packaging Manufacturing, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-334X
Type :
jour
DOI :
10.1109/TEPM.2005.844621
Filename :
1393091
Link To Document :
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