Title :
Polysilicon-emitter SiGe-base bipolar transistors-what happens when Ge gets into the emitter?
Author_Institution :
IBM T. J. Watson Res. Center, Yorktown Heights, NY, USA
fDate :
5/1/2003 12:00:00 AM
Abstract :
An analytical model is developed for evaluating the effect of emitter depth variation on base and collector currents in a polysilicon-emitter SiGe-base bipolar transistor. It is shown that the base current is relatively insensitive to the Ge distribution in the single-crystalline emitter region, consistent with reported experimental results. On the other hand, the collector current and Early voltage are functions of the Ge distribution, Ge-free cap thickness, and final emitter depth. In particular, the current gain and Early voltage could have a strong dependence on emitter depth when there is a residual Ge-free layer left in the final quasi-neutral base. However, if the emitter-base junction is located in a constant-Ge region, then large current gains can be achieved that are relatively insensitive to emitter-depth variation, consistent with reported results. The inverse relationship between current gain and Early voltage is noted and contrasted with that of a wide-gap-emitter HBT.
Keywords :
Ge-Si alloys; current density; doping profiles; elemental semiconductors; germanium; heterojunction bipolar transistors; impurity distribution; semiconductor device models; semiconductor materials; silicon; Early voltage; Ge distribution; Ge-free cap thickness; HBT; Si-SiGe; analytical model; base current; collector current; constant-Ge region; emitter depth variation; emitter-base junction; final emitter depth; polysilicon-emitter SiGe-base bipolar transistors; single-crystalline emitter region; Analytical models; Bipolar transistors; Boron; Diodes; Doping profiles; Fabrication; Heterojunction bipolar transistors; Photonic band gap; Silicon; Voltage;
Journal_Title :
Electron Devices, IEEE Transactions on
DOI :
10.1109/TED.2003.813252