• DocumentCode
    1233914
  • Title

    Super-junction LDMOST on a silicon-on-sapphire substrate

  • Author

    Nassif-Khalil, Sameh G. ; Salama, C. Andre T

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of Toronto, Ont., Canada
  • Volume
    50
  • Issue
    5
  • fYear
    2003
  • fDate
    5/1/2003 12:00:00 AM
  • Firstpage
    1385
  • Lastpage
    1391
  • Abstract
    A super-junction lateral double diffused MOST (SJ-LDMOST) in silicon-on-sapphire technology, targeting power integrated circuits (PICs), is proposed, implemented and characterized. The proposed structure eliminates "substrate-assisted-depletion" effects in lateral SJ devices thus achieving charge compensation between the n and p SJ-pillars as well as a uniform electric field distribution in the drift region in the off-state. Three-dimensional (3-D) simulations of the device, using realistic aspect ratios for the SJ-pillars, indicate that a significant reduction in specific on-resistance for a given breakdown voltage can be achieved as compared to conventional reduced surface field (RESURF) devices. Experimental devices were implemented using a seven mask CMOS compatible process. Fabricated SJ-LDMOSTs with a drift region length of 66 μm and a pillar aspect ratio of 1.2 μm/0.7 μm (width/height) exhibit a specific on-resistance of 0.82 Ω.cm2 and a breakdown voltage (BV) ranging between 500 and 600 V corresponding to less than 8.5% charge imbalance in the pillars.
  • Keywords
    MOS integrated circuits; power MOSFET; power integrated circuits; semiconductor device breakdown; semiconductor device models; silicon-on-insulator; 0.7 micron; 1.2 micron; 3D simulations; 500 to 600 V; 66 micron; SOS substrate; Si-Al2O3; breakdown voltage; drift region; lateral double diffused MOST; lateral power MOSFET; power ICs; power integrated circuits; seven mask CMOS compatible process; specific on-resistance reduction; substrate-assisted-depletion effects elimination; super-junction LDMOSTs; super-junction pillars; uniform electric field distribution; CMOS process; Circuit simulation; Dielectric substrates; Doping; Integrated circuit technology; MOSFET circuits; Power MOSFET; Power engineering and energy; Power integrated circuits; Voltage;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2003.813460
  • Filename
    1210801