A compact model for predicting the isolation of ports in a closed rectangular microchip package

Author

Olson, Hilding M.

Author_Institution

Dept. of Comput. Sci. & Electr. Eng., Lehigh Univ., Bethlehem, PA, USA

Volume

44

Issue

1

fYear

1996

fDate

1/1/1996 12:00:00 AM

Firstpage

81

Lastpage

86

Abstract

This paper presents the derivation of a compact model for predicting the isolation between ports on opposite sides of a microchip package such as would be used for MMIC chips. The model consists of four current sources, two electric, and two magnetic, representing the port currents and voltages which excite the modes of a cavity formed by the interior of the package. The contribution of each mode to the total electric field is summed, and the average of the total tangential field along the two probes that project into the cavity at the ports is set equal to zero. The model, which runs on a PC, is used to compute data for an actual package, and the data is compared with that produced by a commercial electromagnetic analysis package running on a workstation

Keywords

MMIC; cavity resonators; electric fields; electronic engineering computing; integrated circuit modelling; integrated circuit packaging; MMIC chips; cavity; closed rectangular microchip package; compact model; current sources; isolation prediction; ports isolation; total electric field; Apertures; Conductors; Geometry; MMICs; Microstrip; Packaging; Predictive models; Probes; RF signals; Voltage;

fLanguage

English

Journal_Title

Microwave Theory and Techniques, IEEE Transactions on

Publisher

ieee

ISSN

0018-9480

Type

jour

DOI

10.1109/22.481388

Filename

481388