Title :
Corrections to “Use of Elastic Conductive Adhesive as the Bonding Agent for the Fabrication of Vertical Structure GaN-Based LEDs on Flexible Metal Substrate” [1 Apr 08 523-525]
Author :
Kuo, H.-Y. ; Wang, S.-J. ; Wang, Pei-Ren ; Uang, Kai-Ming ; Chen, T.-M. ; Chen, Shen-Li ; Lee, W.-C. ; Hsu, Hong-Kuei ; Chou, Jung-Chuan ; Wu, Chao-Hsin
fDate :
6/15/2008 12:00:00 AM
Abstract :
In the above titled paper (ibid., vol. 20, no. 7, pp. 523-525, 1 Apr 08), there were errors in Table I. The correct table is presented here.
Keywords :
Color; Conductive adhesives; Error correction; Fabrication; Gallium nitride; Light emitting diodes; Microelectronics; Substrates; Thermal expansion; Wafer bonding;
Journal_Title :
Photonics Technology Letters, IEEE
DOI :
10.1109/LPT.2008.924293
