Title :
Compression bonding process for manufacture of high-performance electrical coils
Author :
Boesel, Robert P.
Abstract :
The use of compression bonding to improve the performance of electromechanical devices by producing temperature-resistant, high-strength coils with great precision is discussed. The process provides coils of higher density, which are better able to dissipate the heat caused by higher current levels and can be placed closer to the target of the magnetic flux they produce by virtue of their more precise form and greater strength. The comparison bonding process, equipment, and methods are described.<>
Keywords :
coils; electronic equipment manufacture; compression bonding; current levels; electrical coils; electromechanical devices; magnetic flux; Bonding; Coils; Conductors; Magnetic flux; Manufacturing processes; Production; Space technology; Temperature; Wire; Wounds;
Journal_Title :
Electrical Insulation Magazine, IEEE
