A GHz multi-channel cryogenic test fixture for superconducting integrated circuit testing

Author

Aoyagi, Masahiro ; Kikuchi, Katsuya ; Sato, Yuichiro ; Nakagawa, Hiroshi ; Sato, Hiroshi ; Tokoro, Kazuhiko ; Akoh, Hiroshi

Author_Institution

Nat. Inst. of Adv. Ind. Sci. & Technol., Ibaraki, Japan

Volume

13

Issue

2

fYear

2003

fDate

6/1/2003 12:00:00 AM

Firstpage

459

Lastpage

462

Abstract

We have designed a cryogenic test fixture for functional testing of digital and analogue superconducting integrated circuits (IC) in the GHz frequency range. The test fixture consists of a ball grid array (BGA) chip carrier, a detachable BGA socket, a coaxial printed wiring board, and 40 long coaxial cables with SMA connectors. The chip carrier has a microstrip wiring and solder balls. On the chip carrier, a superconducting IC chip is connected using Al wire bonding. The wiring board has a coaxial wiring structure. The wiring characteristic impedance of the chip carrier and the print wiring board was designed to be 50 Ω. In the BGA socket, the BGA chip carrier is electrically connected to the printed wiring board using anisotropic conductive rubber sheet. The coaxial cables are connected to the printed wiring board with soldering. All parts of the system were made with nonmagnetic materials. The high frequency characteristics were partially evaluated by TDR measurement and vector impedance measurement at 4.2 K, 77 K and room temperature.

Keywords

UHF measurement; analogue integrated circuits; ball grid arrays; coaxial cables; cryogenic electronics; digital integrated circuits; electric impedance measurement; integrated circuit testing; microwave reflectometry; superconducting integrated circuits; test equipment; time-domain reflectometry; 4.2 to 77 K; Al; Al wire bonding; BGA chip carrier; GHz frequency range; SMA connectors; TDR measurement; analogue superconducting ICs; anisotropic conductive rubber sheet; ball grid array; coaxial PWB; coaxial cables; coaxial printed wiring board; cryogenic test fixture; detachable BGA socket; digital superconducting ICs; functional testing; high frequency characteristics; microstrip wiring; multi-channel cryogenic test fixture; nonmagnetic materials; solder balls; superconducting IC testing; superconducting integrated circuit testing; Circuit testing; Coaxial cables; Cryogenics; Fixtures; Frequency; Impedance measurement; Integrated circuit testing; Sockets; Superconducting integrated circuits; Wiring;

fLanguage

English

Journal_Title

Applied Superconductivity, IEEE Transactions on

Publisher

ieee

ISSN

1051-8223

Type

jour

DOI

10.1109/TASC.2003.813900

Filename

1211640