DocumentCode
1237449
Title
A Study of Self-Aligned Nitride Erasable OTP Cell by 45-nm CMOS Fully Compatible Process
Author
Huang, Chia-En ; Chen, Ying-Je ; Lai, Han-Chao ; King, Ya-Chin ; Lin, Chrong Jung
Author_Institution
Inst. of Electron. Eng., Nat. Tsing-Hua Univ., Hsinchu
Volume
56
Issue
6
fYear
2009
fDate
6/1/2009 12:00:00 AM
Firstpage
1228
Lastpage
1234
Abstract
This brief proposes a new 45-nm erasable one-time programming cell with a self-aligned nitride (SAN) storage node for logic nonvolatile memory (NVM) applications. The CMOS fully logic-compatible cell was successfully demonstrated using 45-nm CMOS technology with a very small cell size of 0.1188 mum2. This cell-adapting source-side-injection programming scheme has a wide on/off window and superior program efficiency. The SAN cell with five terminals for various operational conditions uses an asymmetrical read voltage to verify the position of the stored charge. This cell also exhibits excellent data retention capability even when the thickness of the logic gate oxide is less than 20 A, and the gate length is shorter than 40 nm. This new cell provides a promising solution for logic NVM beyond a 90-nm node.
Keywords
CMOS integrated circuits; integrated logic circuits; random-access storage; silicon compounds; CMOS fully compatible process; SiN; data retention capability; erasable one-time programming cell; logic gate oxide; nonvolatile memory; self-aligned nitride; size 45 nm; CMOS logic circuits; CMOS process; CMOS technology; Logic design; Logic devices; Logic programming; Manufacturing processes; Nonvolatile memory; Storage area networks; Voltage; Logic compatible; nonvolatile memory (NVM); p-channel; self-aligned nitride (SAN);
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/TED.2009.2018169
Filename
4814512
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