DocumentCode :
1237709
Title :
A 5-GHz Differential Low-Noise Amplifier With High Pin-to-Pin ESD Robustness in a 130-nm CMOS Process
Author :
Hsiao, Yuan-Wen ; Ker, Ming-Dou
Author_Institution :
Inst. of Electron., Nat. Chiao-Tung Univ., Hsinchu
Volume :
57
Issue :
5
fYear :
2009
fDate :
5/1/2009 12:00:00 AM
Firstpage :
1044
Lastpage :
1053
Abstract :
Two electrostatic discharge (ESD)-protected 5-GHz differential low-noise amplifiers (LNAs) are presented with consideration of pin-to-pin ESD protection. The pin-to-pin ESD issue for differential LNAs is addressed for the first time in the literature. Fabricated in a 130-nm CMOS process, both ESD-protected LNAs consume 10.3 mW under 1.2-V power supply. The first LNA with double-diode ESD protection scheme exhibits the power gain of 17.9 dB and noise figure of 2.43 dB at 5 GHz. Its human-body-model (HBM) and machine-model (MM) ESD levels are 2.5 kV and 200 V, respectively. With the same total parasitic capacitance from ESD protection devices, the second LNA with the proposed double silicon-controlled rectifier (SCR) ESD protection scheme has 6.5-kV HBM and 500-V MM ESD robustness, 17.9-dB power gain, and 2.54-dB noise figure at 5 GHz. The ESD test results have shown that the pin-to-pin ESD test is the most critical ESD-test pin combination for the conventional double-diode ESD protection scheme. With the proposed double-SCR ESD protection scheme, the pin-to-pin ESD robustness can be significantly improved without degrading RF performance. Experimental results have shown that the ESD protection circuit for LNA can be co-designed with the input matching network to simultaneously achieve excellent ESD robustness and RF performance.
Keywords :
CMOS integrated circuits; capacitance; circuit stability; differential amplifiers; electrostatic discharge; elemental semiconductors; integrated circuit noise; low noise amplifiers; microwave amplifiers; radiofrequency integrated circuits; silicon; solid-state rectifiers; CMOS process; ESD-test pin; HBM; RF amplifier; SCR; Si; differential LNA; differential low-noise amplifier; double silicon-controlled rectifier; double-diode electrostatic discharge protection; frequency 5 GHz; human body model; input matching network; machine model ESD levels; noise figure; parasitic capacitance; pin-to-pin ESD robustness; power 10.3 mW; power gain; size 130 nm; voltage 1.2 V; voltage 2.5 kV; voltage 200 V; voltage 500 V; voltage 6.5 kV; Electrostatic discharge (ESD); RF integrated circuit (RF IC); low-noise amplifier (LNA); power-rail ESD clamp circuit; silicon-controlled rectifier (SCR); substrate-triggered technique;
fLanguage :
English
Journal_Title :
Microwave Theory and Techniques, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9480
Type :
jour
DOI :
10.1109/TMTT.2009.2017247
Filename :
4814540
Link To Document :
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