• DocumentCode
    1237860
  • Title

    Microstructural study in heteroepitaxial YBa2Cu3O7/Nd2CuO4 multi-layers by using electron microscopy

  • Author

    Gao, J. ; Cheung, Y.L. ; So, S.M.

  • Author_Institution
    Dept. of Phys., Univ. of Hong Kong, China
  • Volume
    13
  • Issue
    2
  • fYear
    2003
  • fDate
    6/1/2003 12:00:00 AM
  • Firstpage
    885
  • Lastpage
    888
  • Abstract
    Neodymium copper oxide Nd2CuO4 (NCO) has been applied as a buffer material to improve the epitaxy of YBa2Cu3O7 (YBCO) thin films on reactive substrates and as a potential barrier to construct multi-layer junctions. The microstructures and interfaces in heteroepitaxial Nd2CuO4/YBCO multi-layer have been characterized by using an electron microscopy. Cross-sectional images obtained on a transmission electron microscopy (TEM) revealed an atomically sharp boundary between layers, underlining the excellent compatibility of NCO with YBCO. No chemical reaction occurred between film and substrate. It was found that all layers grow highly epitaxially with their c-axis perpendicular to the substrate surface. On the other hand, various defects such as mis-oriented grains and stacking faults were found near the interfaces.
  • Keywords
    barium compounds; crystal microstructure; high-temperature superconductors; interface structure; neodymium compounds; stacking faults; superconducting superlattices; transmission electron microscopy; yttrium compounds; TEM; YBa2Cu3O7-Nd2CuO4; atomically sharp boundary; electron microscopy; heteroepitaxial YBa2Cu3O7/Nd2CuO4 multi-layers; high temperature superconductor; interfaces; microstructures; misoriented grains; potential barrier; reactive substrates; stacking faults; Atomic layer deposition; Chemicals; Electron microscopy; Epitaxial growth; Microstructure; Neodymium; Substrates; Transistors; Transmission electron microscopy; Yttrium barium copper oxide;
  • fLanguage
    English
  • Journal_Title
    Applied Superconductivity, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1051-8223
  • Type

    jour

  • DOI
    10.1109/TASC.2003.814059
  • Filename
    1211746