Title :
On-chip coil-integrated STJ using the persistent superconducting current for photon detectors
Author :
Kikuchi, Kazuro ; Taino, Tohru ; Nanme, M. ; Nakagawa, Hirotoshi ; Aoyagi, Masahiro ; Sato, Hikaru ; Akoh, H. ; Iizuka, Tetsuya ; Myoren, Hiroaki ; Takada, Shota ; Maehata, Keisuke ; Ishibashi, Koji ; Sato, Hikaru ; Ikeda, Takashi ; Otani, C. ; Takizawa,
Author_Institution :
Nat. Inst. of Adv. Ind. Sci. & Technol., Ibaraki, Japan
fDate :
6/1/2003 12:00:00 AM
Abstract :
A superconducting tunnel junction (STJ) is very attractive for use in high-energy-resolution photon detectors because of its small energy gap. To detect a single photon, the Josephson current of the STJ has had to be suppressed by an external magnetic field. We demonstrated an on-chip coil-integrated STJ photon detector, which excludes the external magnetic field, allowing a small device size. A normal-distribution function shape was adopted for the superconducting electrodes, which makes the magnetic field supplied to the STJ small. We devise a new superconducting photon detector by combining the above techniques. A new Josephson switching gate is also integrated on the same detector chip in order to drive an on-chip integrated coil by a persistent superconducting current. This behavior was confirmed experimentally using the technology of the fabrication process of the Nb/Al-AlOx/Nb Josephson tunnel junction.
Keywords :
Josephson effect; X-ray detection; niobium; persistent currents; superconducting coils; superconductive tunnelling; Josephson current; Josephson switching gate; Nb-Al-AlOx-Nb; Nb/Al-AlOx/Nb; device size; energy gap; external magnetic field; high-energy-resolution photon detectors; normal-distribution function shape; on-chip coil-integrated STJ; persistent superconducting current; superconducting electrodes; superconducting tunnel junction; Electrodes; Fabrication; Helium; Josephson effect; Josephson junctions; Magnetic fields; Niobium; Shape; Superconducting coils; X-ray detectors;
Journal_Title :
Applied Superconductivity, IEEE Transactions on
DOI :
10.1109/TASC.2003.814173