Title :
Monolithically integrated InP-based photonic chip development for O-CDMA systems
Author :
Ji, Chen ; Broeke, R.G. ; Du, Y. ; Cao, Jing ; Chubun, N. ; Bjeletich, P. ; Olsson, F. ; Lourdudoss, S. ; Welty, R. ; Reinhardt, C. ; Stephan, P.L. ; Yoo, S.J.B.
Author_Institution :
Dept. of Electr. & Comput. Eng., California Univ., Davis, CA, USA
Abstract :
This work discusses photonic integration efforts toward developing an InP-based monolithically integrated photonic chip for optical code-division multiple-access (O-CDMA) system applications. The chip design includes the colliding pulsed mode (CPM) locked laser, the Mach-Zehnder interferometer-based threshold detector (MZI), and the monolithic O-CDMA encoder/decoder chip based on array-waveguide-gratings and phase modulator arrays. The compact 4 × 1 cm monolithic chip can replace a complex and large O-CDMA setup based on bulk optics. The integration technique involves active-passive integration using dry etching, metal organic chemical vapor deposition growth, and lateral hydride vapor phase epitaxy regrowth technologies. The fabricated CPM showed stable 1.54 ps modelocked laser output, the MZI showed excellent O-CDMA threshold detection, and the O-CDMA encoder showed Walsh-code O-CDMA encoding. Further, the fabricated devices showed excellent planarity, which accelerate our progress toward monolithic integration of O-CDMA systems.
Keywords :
III-V semiconductors; MOCVD; Mach-Zehnder interferometers; arrayed waveguide gratings; code division multiple access; decoding; encoding; etching; indium compounds; integrated optics; integrated optoelectronics; laser mode locking; local area networks; optical communication; optical modulation; phase modulation; photodetectors; semiconductor growth; vapour phase epitaxial growth; 1 cm; 1.54 ps; 4 cm; InP; InP-based photonic chip; Mach-Zehnder interferometer; OCMDA systems; Walsh-code encoding; active-passive integration; all-optical LAN; arrayed-waveguide-gratings; bulk optics; chip design; colliding pulsed mode locked laser; decoder chip; device planarity; dry etching; encoder chip; lateral hydride vapor phase epitaxy regrowth; metal organic chemical vapor deposition growth; monolithic chip; monolithic integration; optical code division multiple-access system; phase modulator arrays; photonic chip development; photonic integration; stable laser output; threshold detection; threshold detector; Chip scale packaging; Integrated optics; Laser mode locking; Multiaccess communication; Optical arrays; Optical interferometry; Optical modulation; Optical pulses; Phased arrays; Sensor arrays;
Journal_Title :
Selected Topics in Quantum Electronics, IEEE Journal of
DOI :
10.1109/JSTQE.2004.841710
