• DocumentCode
    1240045
  • Title

    Modular SOC testing with reduced wrapper count

  • Author

    Xu, Qiang ; Nicolici, Nicola

  • Author_Institution
    Dept. of Comput. Sci. & Eng., Chinese Univ. of Hong Kong, China
  • Volume
    24
  • Issue
    12
  • fYear
    2005
  • Firstpage
    1894
  • Lastpage
    1908
  • Abstract
    Motivated by the increasing design for test (DFT) area overhead and potential performance degradation caused by wrapping all the embedded cores for modular system-on-a-chip (SOC) testing, this paper proposes a solution for reducing the number of wrapper boundary register (WBR) cells. By utilizing the functional interconnect topology and the WBRs of the surrounding cores to transfer test stimuli and responses, the WBRs of some cores can be removed without affecting the testability of the SOC. We denote the cores without WBRs as light-wrapped cores and present a new modular SOC test architecture for concurrently testing both the wrapped and the light-wrapped logic cores. Since the WBRs of cores that transfer test stimuli and test responses for light-wrapped cores become shared resources during test, conflicts arise during test scheduling that will negatively impact the test application time. As a consequence, to alleviate this problem, we present a novel test access mechanism (TAM) design algorithm for the proposed SOC test architecture. We conduct experiments on several SOC benchmark circuits and demonstrate that, with an acceptable increase in test application time, the number of WBRs can be significantly decreased. This will ultimately lessen the necessary DFT area for modular SOC testing and reduce the propagation delays between cores.
  • Keywords
    design for testability; integrated circuit design; integrated circuit testing; system-on-chip; DFT area; SOC benchmark circuit; SOC testing; TAM design algorithm; WBR cells; core wrapper; design for test; electronic test; embedded core; functional interconnect topology; light-wrapped core; light-wrapped logic cores; modular SOC test architecture; modular system-on-a-chip testing; performance degradation; propagation delay; test access mechanism design; test scheduling; wrapped logic cores; wrapper boundary register cell; wrapper count; Algorithm design and analysis; Circuit testing; Degradation; Design for testability; Integrated circuit interconnections; Logic testing; System testing; System-on-a-chip; Topology; Wrapping; Core wrapper; electronic test; system-on-a-chip (SOC);
  • fLanguage
    English
  • Journal_Title
    Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0278-0070
  • Type

    jour

  • DOI
    10.1109/TCAD.2005.852447
  • Filename
    1542243