• DocumentCode
    1240277
  • Title

    A simple and low-cost fabrication of polymeric vertical microlens using dip method

  • Author

    Chih-Chao Yang ; Te-Chin Peng ; Yun-Hsun Huang ; Meng-Chyi Wu ; Chong-Long Ho ; Wen-Jeng Ho

  • Author_Institution
    Dept. of Electron. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
  • Volume
    17
  • Issue
    3
  • fYear
    2005
  • fDate
    3/1/2005 12:00:00 AM
  • Firstpage
    603
  • Lastpage
    605
  • Abstract
    Polymeric vertical microlenses (PVMs) using photoresist material SU-8 are fabricated with a simple and low-cost process that can be easily applied to the microoptical/optoelectronic bench. By virtue of the strong adhesive force and liquid cohesion, the PVMs are formed by hanging the liquid SU-8 on walls by a dip method. Then, in order to enhance the thermal stability and reliability of the PVMs, the lenses are baked and exposed in the ultraviolet light to crosslink the SU-8. To characterize the PVMs, we use a single-mode fiber carrying a 1.55-μm wavelength laser light source and utilize BeamScope P5 to observe the beam convergences. The output beams through the PVMs show a vertical far-field angle of 3.04/spl deg/, as compared to 5.53/spl deg/ of the beam without passing through the lenses.
  • Keywords
    microlenses; micromechanical devices; optical fabrication; optical polymers; optical testing; photoresists; reliability; thermal stability; ultraviolet radiation effects; 1.55 mum; beam convergences; crosslink; dip method; laser light source; liquid SU-8; liquid cohesion; low-cost fabrication; microoptical/microelectronic bench; photoresist material; polymeric vertical microlens; reliability; single-mode fiber; strong adhesive force; thermal stability; ultraviolet light exposure; Fiber lasers; Laser beams; Lenses; Light sources; Microoptics; Optical device fabrication; Polymers; Resists; Thermal lensing; Thermal stability; Dip method; SU-8; polymer; vertical microlens;
  • fLanguage
    English
  • Journal_Title
    Photonics Technology Letters, IEEE
  • Publisher
    ieee
  • ISSN
    1041-1135
  • Type

    jour

  • DOI
    10.1109/LPT.2004.842316
  • Filename
    1396028