Title :
AC loss of Nb3Sn-based Rutherford cables with internally and externally added Cu
Author :
Sumption, M.D. ; Collings, E.W. ; Scanlan, R.M. ; Nijhuis, A.
Author_Institution :
LASM, Ohio State Univ., Columbus, OH, USA
fDate :
6/1/2003 12:00:00 AM
Abstract :
Calorimetric measurements of AC loss and hence interstrand contact resistances (ICR) were measured on various stabilized (Cu-added) Nb3Sn Rutherford cables. The cable variations formed two sets; externally added Cu and internally added Cu (mixed strand cables). In the first set, Cu strips were diffusion bonded onto a pre-existing cable. Two distinct variants were made, in the first a Cu strip was added to the "upper" and "lower" cable surfaces and then diffusion bonded during a reaction heat treatment (RHT) of 180 h/650°C under a "cold-applied pressure" of 20 MPa. The second was formed by diffusion bonding a helically wrapped Cu strip along the cable. A control cable with no strip was included in this set. The second set consisted of a cable with approximately 1/3 of the strands replaced with pure Cu wires during the cable winding, and here also a control cable was fabricated for comparison. Calorimetric measurements of AC loss were made on all cables at 4.2 K in a transverse sinusoidal field of amplitude 400 mT, frequency 5 to 90 mHz, applied both parallel and perpendicular to the face of the cable. The loss data were interpreted in terms of an effective interstrand contact resistance, R⊥,eff.
Keywords :
contact resistance; copper; multifilamentary superconductors; niobium alloys; superconducting cables; tin alloys; 20 MPa; 4.2 K; 400 mT; 5 to 90 mHz; 650 degC; AC loss; Cu; Cu strip stabilizer; Nb3Sn; Nb3Sn Rutherford cable; calorimetric measurement; diffusion bonding; interstrand contact resistance; mixed strand cable; multifilamentary superconducting composite; reaction heat treatment; Cables; Diffusion bonding; Electrical resistance measurement; Heat treatment; Loss measurement; Niobium; Strips; Surface treatment; Tin; Wires;
Journal_Title :
Applied Superconductivity, IEEE Transactions on
DOI :
10.1109/TASC.2003.813073