DocumentCode :
1240669
Title :
Micromachined RF-Coupled Cantilever Inverted-Microstrip Millimeter-Wave Filters
Author :
Lucyszyn, Stepan ; Miyaguchi, Kenichi ; Jiang, Hong W. ; Robertson, Ian D. ; Fisher, Gavin ; Lord, Anthony ; Choi, Joo-Young
Author_Institution :
Dept. of Electr. & Electron. Eng., Opt. & Semicond. Devices Group, Imperial Coll. London, London
Volume :
17
Issue :
3
fYear :
2008
fDate :
6/1/2008 12:00:00 AM
Firstpage :
767
Lastpage :
776
Abstract :
This paper introduces a new concept for implementing millimeter-wave filters intended for monolithic integration. The approach uses silicon micromachining and wafer bonding techniques to create inverted-microstrip transmission lines in air and radio frequency (RF)-coupled cantilevers. A third-order filter demonstrated a measured insertion loss of only 0.54 dB at 76.5 GHz. Simple MEMS tuning of 60-GHz coupled-line resonators has also been demonstrated for the first time. This paper could form the basis for a new type of low-loss tunable distributed-element RF microelectromechanical system filter technology for millimeter-wave applications.
Keywords :
MIMIC; cantilevers; cavity resonators; micromachining; micromechanical devices; microstrip filters; millimetre wave filters; silicon compounds; wafer bonding; MEMS tuning; RF microelectromechanical system filter technology; Si; coupled-line resonators; frequency 60 GHz; frequency 76.5 GHz; inverted-microstrip millimeterwave filters; inverted-microstrip transmission lines; loss 0.54 dB; micromachined RF-coupled cantilever; monolithic integration; radio frequency RF-coupled cantilevers; silicon micromachining; third-order filter; wafer bonding techniques; Loss measurement; Micromachining; Millimeter wave measurements; Millimeter wave technology; Monolithic integrated circuits; Radio frequency; Resonator filters; Silicon; Transmission line measurements; Wafer bonding; Cantilever; filter; inverted microstrip; micromachined; millimeter wave; radio frequency microelectromechanical systems (RF MEMS); silicon;
fLanguage :
English
Journal_Title :
Microelectromechanical Systems, Journal of
Publisher :
ieee
ISSN :
1057-7157
Type :
jour
DOI :
10.1109/JMEMS.2008.922081
Filename :
4538090
Link To Document :
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