Title :
Texture and surface analysis of NiO buffer deposited on biaxially textured Ni tapes by a MOCVD method
Author :
Sun, Jong-Won ; Kim, Hyung Seop ; Ji, Bong Ki ; Park, Hai-Woong ; Hong, Gye-Won ; Jung, Choong-Hwan ; Park, Soon-Dong ; Jun, Byung-Hyuk ; Kim, Chan-Joong
Author_Institution :
Dept. of Metall. Eng., Chungnam Nat. Univ., Taejon, South Korea
fDate :
6/1/2003 12:00:00 AM
Abstract :
NiO buffer layers for YBCO coated conductors were deposited on textured Ni substrates by a metal-organic chemical vapor deposition(MOCVD) method. Processing variables were the oxygen partial pressure and substrate temperature. The degree of texture and the surface roughness of the deposited NiO surface were analyzed by X-ray pole figure, atomic force microscopy (AFM), and scanning electron microscope (SEM). The (200) textured NiO layer was formed at 450 ∼ 470 °C and oxygen partial pressure of 1.67 Torr. Out-of-plane(ω-scan) and in-plane(Φ-scan) texture were 10.34° and 10.00°, respectively. The surface roughness estimated by atomic force microscopy was in the range of 3.1 ∼ 4.6 nm which was much smoother than that prepared by an oxidation method. We discuss the development of the (200) texture in the MOCVD-NiO films in terms of processing variables.
Keywords :
MOCVD coatings; X-ray diffraction; atomic force microscopy; barium compounds; high-temperature superconductors; nickel compounds; scanning electron microscopy; superconducting tapes; superconducting thin films; surface texture; surface topography; yttrium compounds; 1.67 torr; 3.1 to 4.6 nm; 450 to 470 degC; MOCVD method; NiO; NiO buffer; SEM; X-ray pole figure; YBCO coated conductors; YBa2Cu3O7; atomic force microscopy; biaxially textured Ni tapes; high temperature superconductor; oxygen partial pressure; substrate temperature; surface analysis; surface roughness; texture; Atomic force microscopy; Atomic layer deposition; Buffer layers; Conductors; MOCVD; Rough surfaces; Scanning electron microscopy; Surface roughness; Surface texture; Yttrium barium copper oxide;
Journal_Title :
Applied Superconductivity, IEEE Transactions on
DOI :
10.1109/TASC.2003.811842