Title :
Thermal management technologies for electronics based on multiwalled carbon nanotube bundles
Author :
Liu, Johan ; Wang, Teng ; Campbell, Eleanor E.B.
Author_Institution :
Chalmers Univ. of Technol., Goteborg
fDate :
3/1/2009 12:00:00 AM
Abstract :
Novel thermal management technologies based on multiwalled carbon nanotube (MWNT) bundles are now under development, aiming at improving the cooling of microelectronics packages.
Keywords :
carbon nanotubes; cooling; thermal management (packaging); cooling; microelectronics packages; multiwalled carbon nanotube bundles; thermal management technologies; Carbon nanotubes; Electronic packaging thermal management; Heat transfer; Independent component analysis; Plasma temperature; Technology management; Temperature sensors; Thermal conductivity; Thermal management; Thermal management of electronics;
Journal_Title :
Nanotechnology Magazine, IEEE
DOI :
10.1109/MNANO.2009.932220
