• DocumentCode
    1240702
  • Title

    Thermal management technologies for electronics based on multiwalled carbon nanotube bundles

  • Author

    Liu, Johan ; Wang, Teng ; Campbell, Eleanor E.B.

  • Author_Institution
    Chalmers Univ. of Technol., Goteborg
  • Volume
    3
  • Issue
    1
  • fYear
    2009
  • fDate
    3/1/2009 12:00:00 AM
  • Firstpage
    16
  • Lastpage
    19
  • Abstract
    Novel thermal management technologies based on multiwalled carbon nanotube (MWNT) bundles are now under development, aiming at improving the cooling of microelectronics packages.
  • Keywords
    carbon nanotubes; cooling; thermal management (packaging); cooling; microelectronics packages; multiwalled carbon nanotube bundles; thermal management technologies; Carbon nanotubes; Electronic packaging thermal management; Heat transfer; Independent component analysis; Plasma temperature; Technology management; Temperature sensors; Thermal conductivity; Thermal management; Thermal management of electronics;
  • fLanguage
    English
  • Journal_Title
    Nanotechnology Magazine, IEEE
  • Publisher
    ieee
  • ISSN
    1932-4510
  • Type

    jour

  • DOI
    10.1109/MNANO.2009.932220
  • Filename
    4815095
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1240702