DocumentCode
1241000
Title
Electrohydrodynamic micropumps with asymmetric electrode geometries for microscale electronics cooling
Author
Kazemi, P. Zangeneh ; Selvaganapathy, P. Ravi ; Ching, Chan Y.
Author_Institution
Dept. of Mech. Eng., McMaster Univ., Hamilton, ON
Volume
16
Issue
2
fYear
2009
fDate
4/1/2009 12:00:00 AM
Firstpage
483
Lastpage
488
Abstract
The development of effective microscale thermal management solutions is important to further advance microscale electronics because of increasing heat flux densities in these devices. There is an increasing trend towards liquid based cooling solutions because of their much higher heat removal capacities compared to air cooling methods. Electrohydrodynamic (EHD) micropumps are ideally suited for these applications due to their small form factor, low power consumption and ability to work with dielectric heat transfer fluids. In addition, EHD micropumps have no moving parts and are amenable to conventional microfabrication techniques. Current EHD micropump designs, however, generate very low flowrates and pressure head to be practically useful. Here, we demonstrate for the first time, that an asymmetry in the electrode geometry (both 2D and 3D) will result in significantly higher pressure generation with lower power consumption than conventional symmetric electrode designs.
Keywords
cooling; electrodes; electrohydrodynamics; heat transfer; integrated circuit packaging; micromechanical devices; micropumps; power consumption; asymmetric electrode geometry; dielectric heat transfer fluids; electrohydrodynamic micropumps; heat flux density; liquid based cooling solutions; microscale electronics cooling; power consumption; pressure generation; Dielectrics; Electrodes; Electrohydrodynamics; Electronics cooling; Energy consumption; Geometry; Heat transfer; Micropumps; Thermal management; Thermal management of electronics; Electrohydrodynamics, micropumps, ion drag, electrode geometry;
fLanguage
English
Journal_Title
Dielectrics and Electrical Insulation, IEEE Transactions on
Publisher
ieee
ISSN
1070-9878
Type
jour
DOI
10.1109/TDEI.2009.4815182
Filename
4815182
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