• DocumentCode
    1241404
  • Title

    A directional coupler of a vertically installed planar circuit structure

  • Author

    Konishi, Yoshihiro ; Awai, Ikuo ; Fukuoka, Yoshiro ; Nakajima, Masamitsu

  • Author_Institution
    Uniden Corp., Chiba, Japan
  • Volume
    36
  • Issue
    6
  • fYear
    1988
  • fDate
    6/1/1988 12:00:00 AM
  • Firstpage
    1057
  • Lastpage
    1063
  • Abstract
    A 3-dB directional coupler is described which is fabricated by installing a vertical second printed circuit board on a main printed circuit board. The added vertical substrate significantly increases the freedom of design parameters. Coupling parameters are easily controlled by changing either the dielectric constants or the thicknesses of the substrates. This makes almost any coupling constant available along with good isolation and a suitable input impedance. The three-dimensional structure also makes a good use of space, resulting in a compact circuit structure. Experimental results agree well with a numerical calculation based on the boundary-element method and show the relaxed tolerances possible in fabrication. Effective permittivities and characteristic impedances for both even and odd modes were obtained and were substituted into the scattering matrix to obtain the parameters for a symmetrical directional coupler. A simplified design chart is also provided showing the dependence of characteristic impedances for odd and even modes on substrate thicknesses used
  • Keywords
    S-matrix theory; directional couplers; electric impedance; permittivity; 3 dB; 3-dB directional coupler; boundary-element method; characteristic impedances; coupling parameters; design chart; design parameters; dielectric constants; even modes; odd modes; permittivities; scattering matrix; substrate thicknesses; three-dimensional structure; vertical PCB; vertically installed planar circuit structure; waveguide components; Coupling circuits; Dielectric constant; Dielectric substrates; Directional couplers; Fabrication; Impedance; Permittivity; Printed circuits; Scattering parameters; Thickness control;
  • fLanguage
    English
  • Journal_Title
    Microwave Theory and Techniques, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9480
  • Type

    jour

  • DOI
    10.1109/22.3632
  • Filename
    3632