DocumentCode :
1241463
Title :
Formation and control of boron buried layers in silicon using an excimer laser
Author :
Verma, G. ; Slaoui, A. ; Talwar, S. ; Sigmon, T.W.
Author_Institution :
Dept. of Electr. Eng. and Appl. Phys., Oregon Graduate Inst. of Sci. & Technol., Portland, OR, USA
Volume :
16
Issue :
1
fYear :
1995
Firstpage :
14
Lastpage :
16
Abstract :
Buried layers have been shown to enhance performance of Si MOSFETs in the deep submicrometer regime. Epitaxial growth methods such as atomic layer doping or ion implantation are currently used for the formation of such doping profiles. In this work, we propose an alternative approach, using a XeCl (/spl lambda/=308 mn) pulsed excimer laser, for the fabrication of pulse-shaped B profiles in Si. This process affords simplicity, versatility, and independent control over the depth, width, and the height of the B buried layer.<>
Keywords :
MOSFET; boron; buried layers; doping profiles; elemental semiconductors; excimer lasers; integrated circuit technology; laser materials processing; semiconductor doping; silicon; xenon compounds; 308 nm; B buried layers; Si MOSFETs; Si:B; XeCl; XeCl pulsed excimer laser; buried layer control; buried layer formation; deep submicrometer regime; fabrication method; pulse-shaped B profiles; Atomic beams; Atomic layer deposition; Boron; Doping profiles; Epitaxial growth; Ion implantation; MOSFETs; Optical pulses; Silicon; Space vector pulse width modulation;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/55.363214
Filename :
363214
Link To Document :
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