Title :
Characterizing superconducting BSSCO tapes and bulk joints
Author :
Vipulanandan, C. ; Lu, W.
Author_Institution :
Mater. Eng. Lab., Houston Univ., TX, USA
fDate :
6/1/2003 12:00:00 AM
Abstract :
For many potential applications, long lengths of superconducting tapes and bulk materials with high current capacities are needed. Producing long lengths of superconducting bulk and tapes by joining is considered a challenge. Superconducting monofilament Bi(2223) tapes were fabricated using the powder in tube method with groove and flat rolling. The tapes were rolled to a final thickness of 250 μm. The tapes and bulk materials were processed using a combination of pressing and sintering. The average critical currents for the tapes and bulk materials were 70 and 180 A at 77 K and self field respectively. Superconducting tapes and bulk specimens were joined using lap and butt configurations and thermomechanically processed to make superconducting joints. The maximum joint efficiencies for the lap and butt joints were in the range of 30% to 100%. The phase changes and microstructural development in the joint region were investigated using hardness measurements, XRD and SEM.
Keywords :
X-ray diffraction; bismuth compounds; calcium compounds; critical currents; hardness; high-temperature superconductors; hot pressing; joining processes; rolling; scanning electron microscopy; sintering; strontium compounds; superconducting tapes; thermomechanical treatment; 180 A; 30 to 100 percent; 70 A; 77 K; BSSCO monofilamentary superconducting tape; Bi2Sr2Ca2Cu3O; SEM; XRD; bulk material; butt joint; critical current; flat rolling; groove rolling; hardness; lap joint; microstructure; phase formation; powder-in-tube method; pressing; self-field; sintering; thermomechanical processing; Critical current; Critical current density; High temperature superconductors; Pressing; Silver; Superconducting coils; Superconducting epitaxial layers; Superconducting films; Superconducting materials; Superconductivity;
Journal_Title :
Applied Superconductivity, IEEE Transactions on
DOI :
10.1109/TASC.2003.812080