Title :
Effects of substrate preparation on the stress of Nb thin films
Author :
Bass, Robert B. ; Lichtenberger, Lydia T. ; Lichtenberger, Arthur W.
Author_Institution :
Dept. of Electr. Eng., Univ. of Virginia, Charlottesville, VA, USA
fDate :
6/1/2003 12:00:00 AM
Abstract :
It is well known that intrinsic stress plays an important role in the superconducting material properties of niobium (Nb) thin films and in the resulting electrical characteristics of superconducting-insulating-superconducting (SIS) junctions made from these films. The role of sputtering pressure, gun operating parameters and substrate fixturing on Nb film stress has been investigated by a number of researchers. In this paper we discuss the role of wafer preparation on the stress of Nb thin films. We have found that ex-situ substrate cleaning and baking as well as in-situ cleaning and deposition sequencing have a significant effect on the resulting measured film stress.
Keywords :
internal stresses; niobium; sputtered coatings; substrates; superconducting thin films; surface cleaning; Nb; SIS junction; baking process; cleaning process; deposition sequencing; electrical characteristics; intrinsic stress; niobium thin film; sputter deposition; substrate preparation; superconducting material; Cleaning; Electric variables; Niobium; Sputtering; Stress; Substrates; Superconducting films; Superconducting materials; Superconducting thin films; Transistors;
Journal_Title :
Applied Superconductivity, IEEE Transactions on
DOI :
10.1109/TASC.2003.812294
