DocumentCode :
1242535
Title :
A comparison of strain effect on critical current in Bi-2223 superconducting tapes in different bending modes
Author :
Shin, Hyung-Seop ; Choi, Su-Yong ; Ko, Dong-Kyun ; Ha, Hong-Soo ; Ha, Dong-Woo ; Oh, Sang-Soo
Author_Institution :
Mech. Eng. Sch., Andong Nat. Univ., Kyungbuk, South Korea
Volume :
13
Issue :
2
fYear :
2003
fDate :
6/1/2003 12:00:00 AM
Firstpage :
3526
Lastpage :
3529
Abstract :
The influence of the bending strain on the critical current (Ic) in Ag alloy/Bi-2223 superconducting tapes was investigated at 77 K. The strain effect on Ic degradation in the different bending modes is discussed in terms of sample geometry and n-value. The Ic degradation behavior with bending occurring across the tape´s width direction called ´hard bending´ is discussed in particular, and compared with results under conventional bending tests known as ´easy bending´. It was found that Ic degraded with increases in the bending strain. In the case of hard bending, greater degradation in Ic occurred than under easy bending. This might be a result of the difference in the filaments cross-section of the tape and the generation of a new type of damage, such as local buckling, expected during hard bending. The n-value also decreased as the bending strain increased and its behavior was similar to the Ic-bending strain relationship.
Keywords :
bending; bismuth compounds; calcium compounds; critical currents; high-temperature superconductors; multifilamentary superconductors; silver alloys; strontium compounds; superconducting tapes; 77 K; Ag alloy/Bi-2223 superconducting tape; bending strain; critical current; easy bending; hard bending; multifilamentary composite; n-value; Capacitive sensors; Critical current; Degradation; High temperature superconductors; Magnetic field induced strain; Superconducting films; Tensile strain; Tensile stress; Testing; Thermal stresses;
fLanguage :
English
Journal_Title :
Applied Superconductivity, IEEE Transactions on
Publisher :
ieee
ISSN :
1051-8223
Type :
jour
DOI :
10.1109/TASC.2003.812388
Filename :
1212389
Link To Document :
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