Title :
All-silica package for tapered couplers
Author :
Fitzgerald, C.M. ; Cryan, C.V. ; Hussey, C.D.
Author_Institution :
Lightwave Technol. Res. Centre, Limerick Univ., Ireland
Abstract :
The primary packaging of singlemode tapered couplers, by fusing the fibre leads with a negligible loss to a silica substrate, is reported. This procedure eliminates adhesive, and ensures matched coefficients of thermal expansion throughout.
Keywords :
optical couplers; optical fibres; packaging; reliability; CTE matching; SiO 2; all silica package; ensures matched coefficients of thermal expansion; fibre leads fused to substrate adhesive elimination; packaging; silica substrate; singlemode tapered couplers;
Journal_Title :
Electronics Letters
DOI :
10.1049/el:19911442
