• DocumentCode
    1243502
  • Title

    Improved breakdown of AlInAs/InGaAs heterojunction bipolar transistors

  • Author

    Fullowan, T.R. ; Pearton, S.J. ; Kopf, R.F. ; Chen, Y.K. ; Chin, M.A. ; Ren, Fengyuan

  • Author_Institution
    AT&T Bell Labs., Murray Hill, NJ, USA
  • Volume
    27
  • Issue
    25
  • fYear
    1991
  • Firstpage
    2340
  • Lastpage
    2341
  • Abstract
    AlInAs/InGaAs heterojunction bipolar transistors exhibiting DC breakdown voltages, Vceo, in excess of 7 V are reported. The layer structure uses a two-stage collector to achieve the high breakdown voltages. The devices are fabricated with a triply selfaligned dry etch process with high yield. Respective fT and fmax values of 80 and 60 GHz are obtained for emitter dimensions of 2*4 mu m2. The combination of layer structure design and processing yields AlInAs/InGaAs with both DC and RF characteristics suitable for large-scale, high-speed digital circuit applications.
  • Keywords
    III-V semiconductors; aluminium compounds; bipolar integrated circuits; electric breakdown of solids; etching; gallium arsenide; heterojunction bipolar transistors; indium compounds; 60 GHz; 7 V; 80 GHz; AlInAs-InGaAs; DC breakdown voltages; HBT; RF characteristics; heterojunction bipolar transistors; high-speed digital circuit applications; layer structure design; triply selfaligned dry etch process; two-stage collector;
  • fLanguage
    English
  • Journal_Title
    Electronics Letters
  • Publisher
    iet
  • ISSN
    0013-5194
  • Type

    jour

  • DOI
    10.1049/el:19911449
  • Filename
    121348