• DocumentCode
    1244134
  • Title

    Long-term hermeticity and biological performance of anodically bonded glass-silicon implantable packages

  • Author

    Harpster, Timothy J. ; Nikles, Stefan A. ; Dokmeci, Mehmet R. ; Najafi, Khalil

  • Author_Institution
    Center for Wireless Integrated Microsystems, Univ. of Michigan, Ann Arbor, MI, USA
  • Volume
    5
  • Issue
    3
  • fYear
    2005
  • Firstpage
    458
  • Lastpage
    466
  • Abstract
    This paper reviews long-term test results obtained from a series of tests on glass-silicon (Si) hermetically sealed packages. Results are presented from 1) a 9.9-year ongoing room temperature phosphate-buffered saline (PBS) soak test of four packages; 2) accelerated soak tests in high temperature saline of 28 samples resulting in an extrapolated mean-time-to-failure (MTTF) at 37°C of 177 years; 3) a 2.7-year in vitro 97°C PBS soak test of a single package; and 4) in situ hermeticity and biocompatibility tests from 12 packages implanted in four guinea pigs-three packages implanted in two guinea pigs (each) for 1 month and another two guinea pigs for 20 and 22 months. All of the packages remained hermetically sealed over the lifetime of the implant. A detailed histological report of the implants is provided suggesting that they elicit no profound adverse reaction from the body.
  • Keywords
    electronics packaging; hermetic seals; prosthetics; accelerated soak tests; biocompatibility tests; biocompatible package; glass-silicon implantable packages; hermetic package; in vivo testing; microsystems packages; phosphate buffered saline soak test; Bonding; Glass; Hermetic seals; Implants; Integrated circuit packaging; Rough surfaces; Surface roughness; Temperature; Testing; Thermal management; Biocompatible package; hermetic package; in vivo testing; microsystems packages;
  • fLanguage
    English
  • Journal_Title
    Device and Materials Reliability, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1530-4388
  • Type

    jour

  • DOI
    10.1109/TDMR.2005.854374
  • Filename
    1545908